Product
HS series The crystal morphology appears to be single platelet with high crystallinity and low graphitization index. The crystals grow preferred in plane direction and this can be clearly observed under SEM, The crystals have a very high aspect ratio. The product has large crystal size, high purity, low specific surface area, increased density, low soluble Borates, hydrophobic and lipophilic nature and no agglomeration. The overall quality is outstanding and matching the advanced quality level of products from all over the world.
The thermal conductivity (TC) of unfilled polymers is around 0.1-0.4 W/m·K. To improve TC, functional fillers are required. Hexagonal boron nitride has the highest thermal conductivity (400 W/m·K)among all non-toxic and electrically insulating materials making it to be the perfect filler choice.By adding HS or HSL a thermal conductivity of more than 10 W/m·K can be achieved in the compound. Meanwhile TC, electrica insulation, lubrication, high temperature resistance, molten metal corrosion resistance and other characteristics of the hexagonal Boron Nitride are outperforming other traditional raw materials. Thus, the hexagonal Boron Nitride can be applied in multiple high-end applications including the cosmetic industry.
| Grade | Average particle size （μm） | SSA (m2/g) | Tap density (g/cm3) | B2O3 (%) | Typical application |
| HSS | 16 | 2.0 | 0.6 | 0.08 | Thermal conduction,cosmetics |
| HS | 20 | 1.5 | 0.6 | 0.08 | Thermal conductive plastics and resins,cosmetics |
| HSL | 30 | 1.0 | 0.6 | 0.08 | Thermal conductive plastics and resins,thermal interface material |
| HSPD | 45 | 0.5 | 0.4 | 0.06 | Thermal conductive plastics and resins,thermal interface material |
| HSPD50 | 55 | 0.5 | 0.4 | 0.06 | Thermal conductive plastics and resins,thermal interface material |
HS series The crystal morphology appears to be single platelet with high crystallinity and low graphitization index. The crystals grow preferred in plane direction and this can be clearly observed under SEM, The crystals have a very high aspect ratio. The product has large crystal size, high purity, low specific surface area, increased density, low soluble Borates, hydrophobic and lipophilic nature and no agglomeration. The overall quality is outstanding and matching the advanced quality level of products from all over the world.
The thermal conductivity (TC) of unfilled polymers is around 0.1-0.4 W/m·K. To improve TC, functional fillers are required. Hexagonal boron nitride has the highest thermal conductivity (400 W/m·K)among all non-toxic and electrically insulating materials making it to be the perfect filler choice.By adding HS or HSL a thermal conductivity of more than 10 W/m·K can be achieved in the compound. Meanwhile TC, electrica insulation, lubrication, high temperature resistance, molten metal corrosion resistance and other characteristics of the hexagonal Boron Nitride are outperforming other traditional raw materials. Thus, the hexagonal Boron Nitride can be applied in multiple high-end applications including the cosmetic industry.
| Grade | Average particle size （μm） | SSA (m2/g) | Tap density (g/cm3) | B2O3 (%) | Typical application |
| HSS | 16 | 2.0 | 0.6 | 0.08 | Thermal conduction,cosmetics |
| HS | 20 | 1.5 | 0.6 | 0.08 | Thermal conductive plastics and resins,cosmetics |
| HSL | 30 | 1.0 | 0.6 | 0.08 | Thermal conductive plastics and resins,thermal interface material |
| HSPD | 45 | 0.5 | 0.4 | 0.06 | Thermal conductive plastics and resins,thermal interface material |
| HSPD50 | 55 | 0.5 | 0.4 | 0.06 | Thermal conductive plastics and resins,thermal interface material |
